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1

Fight against corruption: The common mission for developing countries

Journal:

Journal of Zhejiang University SCIENCE A

Year:

2001

Language:

english

File:

PDF, 468 KB

english, 2001

2

Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area Chips

Lei, T.G., Calata, J.N., Guo-Quan Lu, Xu Chen, Shufang Luo

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2010

Language:

english

File:

PDF, 1.64 MB

english, 2010

3

[IEEE 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - Tampa, FL, USA (2017.3.26-2017.3.30)] 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - A phase-leg IGBT module using DBC substrate without Ag finish by pressureless sintering of nanosilver paste

Yan, Haidong, Mei, Yunhui, Li, Xin, Chen, Gang, Lu, Guo-Quan

Year:

2017

Language:

english

File:

PDF, 3.81 MB

english, 2017

4

Thermo-Mechanical Reliability of Double-Sided IGBT Assembly Bonded by Sintered Nanosilver

Mei, Yun-Hui, Lian, Jiao-Yuan, Chen, Xu, Chen, Gang, Li, Xin, Lu, Guo-Quan

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.68 MB

english, 2014

5

Feasibility investigation and characterization of low-pressure-assisted sintered-silver bonded large-area DBA plates

Tan, Yansong, Li, Xin, Chen, Xu, Yang, Zhenwen, Lu, Guo-Quan

Journal:

Soldering & Surface Mount Technology

Year:

2019

File:

PDF, 2.01 MB

2019

6

[IEEE 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Cincinnati, OH (2017.10.1-2017.10.5)] 2017 IEEE Energy Conversion Congress and Exposition (ECCE) - Bonding of large substrates by silver sintering and characterization of the interface thermal resistance

Gao, Shan, Yang, Zhenwen, Tan, Yansong, Li, Xin, Chen, Xu, Sun, Zhan, Lu, Guo-Quan

Year:

2017

Language:

english

File:

PDF, 450 KB

english, 2017

7

Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability

Xu Chen, Y.C. Lin, Xingsheng Liu, Guo-Quan Lu

Journal:

Engineering Fracture Mechanics

Year:

2005

Language:

english

File:

PDF, 629 KB

english, 2005

8

Pressure-Assisted Low-Temperature Sintering of Nanosilver Paste for 5$\,\times\,$5-${\rm mm}^{2}$ Chip Attachment

Gang Chen,, Yunjiao Cao,, Yunhui Mei,, Dan Han,, Guo-Quan Lu,, Xu Chen,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1.96 MB

english, 2012

9

Effect of substrate flexibility on solder joint reliability. Part II: finite element modeling

Y.C. Lin, X. Chen, Xingsheng Liu, Guo-Quan Lu

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 658 KB

english, 2005

10

Effects of thermal aging on long-term reliability and failure modes of nano-silver sintered lap-shear joint

Tan, Yansong, Li, Xin, Chen, Gang, Gao, Qitong, Lu, Guo-Quan, Chen, Xu

Journal:

International Journal of Adhesion and Adhesives

Year:

2019

Language:

english

File:

PDF, 4.78 MB

english, 2019

11

Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

Yan, Yi, Guan, Youliang, Chen, Xu, Lu, Guo-Quan

Journal:

Journal of Electronic Packaging

Year:

2013

Language:

english

File:

PDF, 1.76 MB

english, 2013

12

Investigation of Post-Etch Copper Residue on Direct Bonded Copper (DBC) Substrates

Yunhui Mei, Guo-Quan Lu, Xu Chen, Chen Gang, Shufang Luo, Dimeji Ibitayo

Journal:

Journal of Electronic Materials

Year:

2011

Language:

english

File:

PDF, 1.44 MB

english, 2011

13

Effect of Oxygen Partial Pressure on Silver Migration of Low-Temperature Sintered Nanosilver Die-Attach Material

Mei, Yunhui, Lu, Guo-Quan, Chen, Xu, Luo, Shufang, Ibitayo, Dimeji

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2011

Language:

english

File:

PDF, 385 KB

english, 2011

14

Rapid Sintering Nanosilver Joint by Pulse Current for Power Electronics Packaging

Mei, Yunhui, Cao, Yunjiao, Chen, Gang, Li, Xin, Lu, Guo-Quan, Chen, Xu

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2013

Language:

english

File:

PDF, 940 KB

english, 2013

15

Shrinkage and Sintering Behavior of a Low-Temperature Sinterable Nanosilver Die-Attach Paste

Tao Wang, Meihua Zhao, Xu Chen, Guo-Quan Lu, Khai Ngo, Shufang Luo

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 1.46 MB

english, 2012

16

Ratcheting behavior of sandwiched assembly joined by sintered nanosilver for power electronics packaging

Chen, Gang, Zhang, Ze-Sheng, Mei, Yun-Hui, Li, Xin, Lu, Guo-Quan, Chen, Xu

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1009 KB

english, 2013

17

[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - How to pressureless sinter-bond power chips with bare copper substrates using nanosilver paste?

Chen, Yue, Mei, Yunhui., Feng, Zhihong, Lu, Panpan, Wang, Meiyu, Yang, Yingkun, Lu, Guo-Quan

Year:

2019

File:

PDF, 2.93 MB

2019

18

Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Tao Wang, Xu Chen, Guo-Quan Lu, Guang-Yin Lei

Journal:

Journal of Electronic Materials

Year:

2007

Language:

english

File:

PDF, 426 KB

english, 2007

19

High temperature ratcheting behavior of nano-silver paste sintered lap shear joint under cyclic shear force

Li, Xin, Chen, Gang, Chen, Xu, Lu, Guo-Quan, Wang, Lei, Mei, Yun-Hui

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.64 MB

english, 2013

20

Mechanism of Migration of Sintered Nanosilver at High Temperatures in Dry Air for Electronic Packaging

Lu, Guo-Quan, Yang, Wen, Mei, Yun-Hui, Li, Xin, Chen, Gang, Chen, Xu

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.41 MB

english, 2014

21

Synthesis, structure and femtosecond nonlinear absorption properties of Ce-ZnO films

Chen, Zi-Wen, Yao, Cheng-Bao, Han, Yue, Bao, Sheng-Bin, Jiang, Guo-Quan, Cai, Yu

Journal:

Applied Surface Science

Year:

2020

Language:

english

File:

PDF, 5.25 MB

english, 2020

22

Efficient layout design automation for multi-chip SiC modules targeting small footprint and low parasitic

Mei, Yunhui, Hao, Baisen, Chen, Yue, Wang, Meiyu, Li, Xin, Lu, Guo-Quan

Journal:

IET Power Electronics

Year:

2020

File:

PDF, 2.02 MB

2020

23

[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Migration of sintered nanosilver die-attach material on alumina substrate at high temperatures

Mei, Yunhui, Ibitayo, Dimeji, Chen, Xu, Luo, Susan, Lu, Guo-Quan

Year:

2011

Language:

english

File:

PDF, 2.23 MB

english, 2011

24

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

Li, Xin, Chen, Xu, Lu, Guo-Quan

Journal:

Journal of Electronic Packaging

Year:

2010

Language:

english

File:

PDF, 678 KB

english, 2010

25

Die Bonding of High Power 808 nm Laser Diodes With Nanosilver Paste

Yan, Yi, Chen, Xu, Liu, Xingsheng, Mei, Yunhui, Lu, Guo-Quan

Journal:

Journal of Electronic Packaging

Year:

2012

Language:

english

File:

PDF, 1.96 MB

english, 2012

26

STRUCTURE OF ISOCHAMAEJASMIN FROM STELLERA CHAMAEJASME L.

Niwa, Masatake, Chen, Xiang-Fang, Liu, Guo-Quan, Tatematsu, Hiroshi, Hirata, Yoshimasa

Journal:

Chemistry Letters

Year:

1984

Language:

english

File:

PDF, 5.36 MB

english, 1984

27

Low-Pressure-Assisted Large-Area (>800 mm 2 ) Sintered-Silver Bonding for High-Power Electronic Packaging

Tan, Yan-Song, Li, Xin, Chen, Xu, Lu, Guo-Quan, Mei, Yun-Hui

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 2.78 MB

english, 2018

28

Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste

Xu Chen, Rong Li, Kun Qi, Guo-Quan Lu

Journal:

Journal of Electronic Materials

Year:

2008

Language:

english

File:

PDF, 348 KB

english, 2008

29

Transient Thermal Performance of IGBT Power Modules Attached by Low-Temperature Sintered Nanosilver

Gang Chen, Dan Han, Yun-Hui Mei, Xiao Cao, Tao Wang, Xu Chen, Guo-Quan Lu

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2012

Language:

english

File:

PDF, 1019 KB

english, 2012

30

Migration of Sintered Nanosilver Die-Attach Material on Alumina Substrate Between 250 and 400 in Dry Air

Yunhui Mei, Guo-Quan Lu, Xu Chen, Shufang Luo, Ibitayo, D.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2011

Language:

english

File:

PDF, 794 KB

english, 2011

31

Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging

Fu, Shancan, Mei, Yunhui, Lu, Guo-Quan, Li, Xin, Chen, Gang, Chen, Xu

Journal:

Materials Letters

Year:

2014

Language:

english

File:

PDF, 1.28 MB

english, 2014

32

Characterization of Encapsulants for High-Voltage High-Temperature Power Electronic Packaging

Yiying Yao, Zheng Chen, Guo-Quan Lu, Boroyevich, D., Ngo, K.D.T.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2012

Language:

english

File:

PDF, 1000 KB

english, 2012

33

Separable and recyclable meso-carbon@TiO2/carbon fiber composites for visible-light photocatalysis and photoelectrocatalysis

Chen, Hua-Jun, Yang, Yan-Ling, Hong, Min, Chen, Jin-Geng, Suo, Guo-Quan, Hou, Xiao-Jiang, Feng, Lei, Chen, Zhi-Gang

Journal:

Sustainable Materials and Technologies

Year:

2019

Language:

english

File:

PDF, 1.67 MB

english, 2019

34

Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment

Dun-ji Yu, Xu Chen, Gang Chen, Guo-quan Lu, Zheng-qiang Wang

Journal:

Materials & Design

Year:

2009

Language:

english

File:

PDF, 1.05 MB

english, 2009

35

Vector spatiotemporal localized structures in (3\(+\)1)-dimensional strongly nonlocal nonlinear media

Dai, Chao-Qing, Fan, Yan, Zhou, Guo-Quan, Zheng, Jun, Chen, Liang

Journal:

Nonlinear Dynamics

Year:

2016

Language:

english

File:

PDF, 3.06 MB

english, 2016

36

Clinical observation of tuina techniques in treating muscular torticollis in 33 infants

Chen Zhi-wei, Shen Guo-quan, Fang Min

Journal:

Journal of Acupuncture and Tuina Science

Year:

2004

Language:

english

File:

PDF, 259 KB

english, 2004

37

Characterization and Reliability of Sintered Nanosilver Joints by a Rapid Current-Assisted Method for Power Electronics Packaging

Mei, Yun-Hui, Cao, Yunjiao, Chen, Gang, Li, Xin, Lu, Guo-Quan, Chen, Xu

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2014

Language:

english

File:

PDF, 1.02 MB

english, 2014

38

Synergistic flame retardant effects of nano-kaolin and nano-HAO on LDPE/EPDM composites

Zhi-Hong Chang, Fen Guo, Jian-Feng Chen, Jiang-Hua Yu, Guo-Quan Wang

Journal:

Polymer Degradation and Stability

Year:

2007

Language:

english

File:

PDF, 884 KB

english, 2007

39

Electrokinetic removal of Cu and Zn in anaerobic digestate: Interrelation between metal speciation and electrokinetic treatments

Zhu, Neng-min, Chen, Mengjun, Guo, Xu-jing, Hu, Guo-quan, Yu-Deng,

Journal:

Journal of Hazardous Materials

Year:

2015

Language:

english

File:

PDF, 324 KB

english, 2015

40

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Characterization of encapsulants for high-voltage, high-temperature power electronic packaging

Yao, Yiying, Chen, Zheng, Lu, Guo-Quan, Boroyevich, Dushan, Ngo, Khai D. T.

Year:

2010

Language:

english

File:

PDF, 970 KB

english, 2010

41

Study on the interaction of intense femtosecond laser pulses with nanometre-sized hydrogen clusters

Li, Zheng, Cheng, Wang, Shao-Hui, Li, Bing-Chen, Liu, Guo-Quan, Ni, Ru-Xin, Li, Zhi-Zhan, Xu

Journal:

Chinese Physics

Year:

2006

Language:

english

File:

PDF, 524 KB

english, 2006

42

Two Types of Mass Abundance Distributions for Anionic Carbon Clusters Investigated by Laser Vaporization and Pulsed Molecular Beam Techniques

Zhai, Hua-Jin, Liu, Bing-Chen, Zhou, Ru-Fang, Ni, Guo-Quan, Xu, Zhi-Zhan

Journal:

Chinese Physics Letters

Year:

2000

Language:

english

File:

PDF, 339 KB

english, 2000

43

Input price, isocost and maximum output under fuzziness

Guo-quan Chen, Eden S.H. Yu

Journal:

Mathematical Social Sciences

Year:

1987

Language:

english

File:

PDF, 707 KB

english, 1987

44

Effect of intermediate cooling on precipitation behavior and austenite decomposition of V–Ti–N steel for non-quenched and tempered oil-well tubes

Sheng-Xin Liu, Yong Chen, Guo-Quan Liu, Yong-Gang Zhang, Jian-Kai Huang

Journal:

Materials Science and Engineering: A

Year:

2008

Language:

english

File:

PDF, 1.33 MB

english, 2008

45

Transient Thermal Impedance Measurements on Low-Temperature-Sintered Nanoscale Silver Joints

Yunhui Mei, Tao Wang, Xiao Cao, Gang Chen, Guo-Quan Lu, Xu Chen

Journal:

Journal of Electronic Materials

Year:

2012

Language:

english

File:

PDF, 636 KB

english, 2012

46

[IEEE 2014 International Conference on Power System Technology (POWERCON) - Chengdu (2014.10.20-2014.10.22)] 2014 International Conference on Power System Technology - The reactive compensation device coordination configuration method based on improved optimal covering method

Zhao Hong-sheng,, Duan Guo-quan,, Liu Di-chen,, Wu Jun,, Lin-ge, Q. I., Li-na, K. E.

Year:

2014

Language:

english

File:

PDF, 626 KB

english, 2014

47

ChemInform Abstract: Synthesis of 1,2,3-Triazoles from Azide-Derivatised Aminocyclitols by Catalytic Diazo Transfer and CuAAC Click Chemistry.

Ji, Li, Zhou, Guo-Quan, Qian, Chao, Chen, Xin-Zhi

Journal:

Year:

2015

File:

PDF, 23 KB

2015

48

Adaption of microbial community during the start-up stage of a thermophilic anaerobic digester treating food waste

Wu, Bo, Wang, Xing, Deng, Ya-Yue, He, Xiao-Lan, Li, Zheng-Wei, Li, Qiang, Qin, Han, Chen, Jing-Tao, He, Ming-Xiong, Zhang, Min, Hu, Guo-Quan, Yin, Xiao-Bo

Journal:

Bioscience Biotechnology and Biochemistry

Year:

2016

Language:

english

File:

PDF, 1.07 MB

english, 2016

49

HPPR encodes the hydroxyphenylpyruvate reductase required for the biosynthesis of hydrophilic phenolic acids in Salvia miltiorrhiza

WANG, Guo-Quan, CHEN, Jun-Feng, YI, Bo, TAN, He-Xin, ZHANG, Lei, CHEN, Wan-Sheng

Journal:

Chinese Journal of Natural Medicines (Imprint ELSEVIER)

Year:

2017

Language:

english

File:

PDF, 2.71 MB

english, 2017

50

Synergic flame retardancy mechanism of montmorillonite in the nano-sized hydroxyl aluminum oxalate/LDPE/EPDM system

Zhi-Hong Chang, Fen Guo, Jian-Feng Chen, Lei Zuo, Jiang-Hua Yu, Guo-Quan Wang

Journal:

Year:

2007

Language:

english

File:

PDF, 1.44 MB

english, 2007

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